Introducing  X-Mesh

TDMA-based wireless communication technology with high reliability, low power and low latency characteristics in harsh environment

High Reliability

The application of channel hopping and channel adaptation techniques enables high-confidence wireless communication in an environment where severe channel interference occurs in the ISM band.

  • Data Reliability (>99.999%)
  • Support Wireless channel Interference Avoidance (Multi-Channel Hopping)
  • Support Clear channel Self-Detection
  • Support Acknowledged Message
  • Support Self-Heals
  • Support Beacon Multi-Channel Hopping

Low Power Consumption

It supports 1% to 0.01% of active usage time with variable duty-cycling application, allowing it to operate on one battery for more than 10 years.

  • Low power (>10 year battery life)
  • Support Low power mode
  • Support Stop mode(Sleep mode)

Low Latency

Time-Slot scheduling by routing path minimizes transmission delays between end nodes.

  • Low latency of data transmission
  • Multi-hop TDMA MAC thechnology

Time Synchronization

High-precision visual motivation and calibration techniques are applied to ensure high visual motivation.

  • Multi-hop Time Sync
  • Multi-hop Time error correction

Mesh Topology

Support for Mesh, Tree, Star Topologies

  • Built-In Self Wireless network automatic configuration and management
  • Scalable to more than 50,000 nodes
  • Bidirectional Communication for Monitoring and Control
  • Support Node Mobility
  • Support Health check
  • Support C-Skip and Source Routing Protocol

Standard based Wireless Technology

IEEE802.15.4e DSME

  • Support IEEE802.15.4e DSME MAC
  • Support IEEE802.15.4



  • Support Multiple PHY(900MHz, 2.4GHz)
  • Support Secure AES 128-bit Encription/Decription
  • Support Multi-hop Over the Air Firmware Upgrades(Multi-top OTA)
  • Support Flexible Downlink/Uplink Capability
  • Support Dynamic Uplink Power Control
  • Support MAC layer Transmit Retry
  • Support Read and Control Peripherals (GPIO, ADC, SPI, UART, I2C)
  • Support User-Programmable ARM Cortex-M3 (Application Layer)